For safety, quality, security, use Kaydeli!
For safety, quality, security, use Kaydeli!
In semiconductor manufacturing, precise and stable temperature control directly affects chip performance, yield rate, and production cost. As process nodes continue to shrink and the AI computing era drives higher power density in CPUs and GPUs, efficient thermal management becomes a key factor for success. From wafer fabrication to packaging and testing, every stage demands consistent temperature stability.
Temperature control is crucial throughout semiconductor manufacturing. Each process step—from oxidation and diffusion to lithography, etching, and film deposition—requires specific temperature conditions to ensure accuracy and reliability. Typically, temperature precision must be controlled within ±0.1°C, and in some high-end processes, even within ±0.05°C.
A recent Kaydeli project review of a large-scale semiconductor cooling system highlighted how a well-designed water cooled chiller and heating solution can ensure process stability, improve product consistency, and reduce energy consumption. The customer achieved around a 1.5% increase in yield rate and an 18% reduction in energy consumption after optimization.
In the lithography stage, the light source generates significant heat. Even a temperature fluctuation of more than 0.1°C can cause exposure deviations and affect line width accuracy. To prevent this, the lithography machines use chillers to maintain stable temperatures for the laser source and optical components.
Similarly, etching and ion implantation processes release large amounts of heat that must be dissipated quickly. Chillers maintain the temperature of chamber walls and electrostatic chucks within the range of 60–80°C, dynamically adjusted according to the process. For ion implantation systems, the cooling of beam targets must stay within ±0.5°C. By combining plate heat exchangers with deionized water circuits, chillers ensure precise thermal balance and stable operation.
Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) systems require rapid temperature transitions between high and low temperatures. A dual-stage chiller system provides a wide control range from -15°C to 80°C, ensuring precise thermal support for different coating materials. This flexibility allows semiconductor manufacturers to achieve uniform film thickness and high production yield.
Modern semiconductor fabs increasingly adopt centralized cooling and heating systems instead of decentralized ones. A centralized system can deliver more stable performance, improve redundancy, and simplify energy management.
In the reviewed project, the client used a modular chiller system that automatically adjusted its operation based on real-time plant load. This design included redundancy measures to ensure uninterrupted cooling even during equipment maintenance. The system achieved a Coefficient of Performance (COP) of 5.2 at full load—significantly above the industry average.
The cooling system was divided into three independent loops for efficiency:
Low-Temperature Loop (7°C/12°C) – Serves lithography and ion implantation equipment, using a falling-film evaporator and electronic expansion valves for ±0.1°C precision, with a COP of 4.2.
Medium-Temperature Loop (15°C/20°C) – Handles etching and film deposition through indirect heat exchange with plate heat exchangers to prevent cross-contamination.
Normal-Temperature Loop (25°C/30°C) – Supports cleanroom air conditioning and exhaust systems, with variable-speed pumps ensuring a maximum supply distance of 300 meters and a pressure loss under 0.15 MPa.
The system’s intelligent control platform analyzed real-time equipment load data and adjusted chiller parameters proactively. This predictive capability helped maintain precise temperature balance and prevented performance degradation. The fault diagnosis function provided early warnings, enabling preventive maintenance and reducing downtime.
Moreover, the system featured a heat recovery unit, which captured process waste heat and reused it elsewhere. For instance, heat absorbed during cooling was upgraded from 55°C to 80°C for photoresist developer heating, replacing traditional electric heaters. This energy recycling design improved the system’s annual overall energy efficiency by about 25%.
Since its commissioning in March 2024, the system has operated steadily for 18 months with outstanding results:
Process Performance: Lithography line-width uniformity improved from 1.8 nm to 1.5 nm; etching size deviation was reduced to ±0.3 nm; overall wafer yield increased by 2.3%. The target replacement cycle in ion implantation extended from 15 to 22 days, cutting downtime by 180 hours per year.
Energy and Cost Savings: The total energy efficiency ratio reached 4.8, cutting energy consumption by 31% compared with traditional decentralized systems. Annual electricity savings were approximately 12 million RMB. The centralized design also reduced floor space by 40% and maintenance manpower by 30%, achieving full return on investment within four years.
The evolution of semiconductor cooling has progressed from simple equipment-based control to factory-wide integrated energy management. Today, chillers and industrial heat pumps are essential infrastructures supporting advanced semiconductor manufacturing.
As semiconductor processes continue to advance toward smaller nodes and higher integration levels, precise temperature control and energy optimization will become even more critical.
Kaydeli remains committed to developing advanced chiller and temperature control solutions that meet the stringent demands of the semiconductor industry. As a trusted chiller manufacturer, Kaydeli continues to innovate in thermal stability, energy efficiency, and intelligent control systems—helping semiconductor manufacturers achieve reliable production, consistent quality, and sustainable growth.
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